Ni ball, Ni nuclear ball, solder joint, foam solder and solder paste
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United States of America Patent
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Nov 14, 2017
Grant Date -
Oct 20, 2016
app pub date -
Sep 19, 2013
filing date -
Sep 19, 2013
priority date (Note) -
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Abstract
To provide a Ni ball having a low α dose and high sphericity even when it contains impurity elements other than Ni in certain amounts. The Ni ball contains an element U, a content thereof being 5 ppb or less, and an element Th, a content thereof being 5 ppb or less, wherein a purity of the Ni ball is 99.9% or more but 99.995% or less, an α dose thereof is 0.0200 cph/cm2 or less, a content of either Pb or Bi, or a total content of both Pb and Bi is 1 ppm or more, and a sphericity thereof is 0.90 or more, in order to prevent any software errors and reduce connection failure.
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