Method for joining substrates
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 14, 2017
Issued Date -
N/A
app pub date -
Feb 21, 2012
filing date -
Feb 22, 2011
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The invention relates to a method of joining substrates. It is the object of the invention in this respect to join substrates of substrate materials together without having to exert an increased effort for a coating with additional coating processes to be carried out and to be able to achieve a good quality of the join connection in so doing. In the method in accordance with the invention a pretreatment of at least one join surface of a substrate to be joined is carried out in low pressure oxygen plasma prior to the actual joining. On the joining, a contact force acts on the substrates to be joined in the range 2 kPa to 5 MPa and in this process a heat treatment is carried out at an elevated temperature of at least 100° C. and at under pressure conditions of a maximum of 10 mbar, preferably <10−3 mbar.
First Claim
Family
International Classification(s)
- C03C:CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREO....
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- C03B:MANUFACTURE OR SHAPING OF GLASS, OR OF MINERAL OR ....
- C04B:LIME; MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREO....
- B23K:SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLA....
- B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully