Method of manufacturing electronic package module
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United States of America Patent
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Nov 7, 2017
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app pub date -
Jul 31, 2013
filing date -
Jul 31, 2013
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Abstract
A method of manufacturing electronic package module is provided. The method provides selective molding by attaching tapes on the circuit substrate on which electric components are mounted thereon, forming molding compound to cover the circuit substrate, and removing tapes along with the molding compound thereon.
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