Side-cooled modular data center
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United States of America Patent
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Nov 7, 2017
Issued Date -
N/A
app pub date -
Apr 27, 2016
filing date -
May 1, 2015
priority date (Note) -
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Abstract
A modular data center includes a cooling module with a cooling module enclosure and a first cooling unit housed within the cooling module enclosure. The cooling module enclosure includes a first interface side wall with a first cooling module supply opening that receives a first portion of cooling air from the first cooling unit. The center further includes a data module with a data module enclosure for housing data equipment. The data module enclosure includes a second interface side wall with a first data module supply opening that receives the first portion of cooling air from the first cooling module supply opening such that the first portion of cooling air flows into the data module enclosure and removes heat from the data equipment.
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