Molded printed circuit board
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United States of America Patent
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Nov 7, 2017
Issued Date -
N/A
app pub date -
Sep 10, 2013
filing date -
Apr 23, 2010
priority date (Note) -
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Abstract
Described herein is a molded printed circuit board. The printed circuit board may be placed inside of a mold and a material is injected therein. The material hardens in the mold around the printed circuit board thereby forming an overmolded printed circuit board. The overmolded material may have apertures in it to allow access to the leads on the printed circuit board so that components to be connected to it. The overmolded printed circuit boards may allow a plurality of electrical components to selectively and removably attach to it. Further, the printed circuit board may be attached in a housing which may itself removably and selectively connect to components.
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