Composite substrate, semiconductor device, and method for manufacturing semiconductor device
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United States of America Patent
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Nov 7, 2017
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N/A
app pub date -
Aug 13, 2015
filing date -
Feb 19, 2013
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Abstract
A composite substrate 10 includes a semiconductor substrate 12 and an insulating support substrate 14 that are laminated together. The support substrate 14 includes first and second substrates 14a and 14b made of the same material and bonded together with a strength that allows the first and second substrates 14a and 14b to be separated from each other with a blade. The semiconductor substrate 12 is laminated on a surface of the first substrate 14a opposite a surface thereof bonded to the second substrate 14b.
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