Systems and methods for measuring physical characteristics of semiconductor device elements using structured light
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United States of America Patent
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Nov 7, 2017
Issued Date -
Mar 5, 2015
app pub date -
Aug 27, 2014
filing date -
Sep 3, 2013
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Abstract
A method of determining a physical characteristic of an adhesive material on a semiconductor device element using structured light is provided. The method includes the steps of: (1) applying a structured light pattern to an adhesive material on a semiconductor device element; (2) creating an image of the structured light pattern using a camera; and (3) analyzing the image of the structured light pattern to determine a physical characteristic of the adhesive material. Additional methods and systems for determining physical characteristics of semiconductor devices and elements using structured light are also provided.
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