Temperature measuring board device and temperature measuring board thereof
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United States of America Patent
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Nov 7, 2017
Issued Date -
N/A
app pub date -
Oct 8, 2014
filing date -
May 6, 2014
priority date (Note) -
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Abstract
A temperature measuring board for use in measuring an oven temperature of a reflow oven includes a modular substrate and a thermal compensation unit. The modular substrate includes a plurality of substrates assembled to each other. Each substrate has at least one first fixing portion, and at least one second fixing portion removably fixed to the first fixing portion of another substrate. A selected number of the substrates can be assembled to each other to form a desired shape of the modular substrate through engagement of the first and second fixing portions. The thermal compensation unit includes at least one surface-measured compensation member fixed to the modular substrate at a selected location.
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