Method for manufacturing a lamp-housing-type heat-sink, lamp-housing-type heat-sink, and LED lighting device
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United States of America Patent
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Nov 7, 2017
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N/A
app pub date -
Sep 20, 2012
filing date -
Oct 26, 2011
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Abstract
A lamp-housing-type heat-sink in an LED lighting device is provided, which is a hollow middle part formed monolithically by extending a high purity aluminum plate with a thickness of 0.5 mm to 5 mm and an aluminum content of above 95%. The heat-sink has a heat-sinking surface and housing body. A surface contact structure is formed between the heat-sinking surface and a circuit board, and several radiating holes are set on the housing body to form heat dissipation channels. A method for manufacturing the lamp-housing-type heat-sink in LED lighting device is also provided. The lamp-housing-type heat-sink uses fewer materials and costs less than conventional die-cast aluminum housing, while providing a higher thermal conductivity co-efficient.
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