Process for making molded devices
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United States of America Patent
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Nov 7, 2017
Issued Date -
N/A
app pub date -
Nov 21, 2014
filing date -
Dec 2, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
This invention is directed to a process for applying a symbol to a molded device which symbol on the molded device is visible as an indentation in the surface of the device. The process involves the step of applying the symbol as an elevation to the mold before using the mold for making the molded device. The process of the invention is characterized in that the elevation on the mold is produced by applying a material to the mold surface which material is liquid when being applied and which material is applied at a temperature higher than the temperature which is at or preferably below the melting point of the material, and which material solidifies at the temperature of the mold. The material applied to the mold and solidified on the mold surface as an elevation needs to remain solid during the process of using the mold for making the molded device. During the molding process the elevation of the symbol on the mold is transferred as an indentation of the symbol to the surface of the molded device. After the molding process is complete and the molded device has been separated from the mold the elevation on the mold surface can be removed and the mold can be re-used without an elevation or with another elevation being applied to make another molded device.
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