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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
SENJU METAL INDUSTRY CO LTD	23 SENJU-HASHIDO-CHO ADACHI-KU TOKYO 120-8555

International Classification(s)

• B23K:SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLA....
• C22C:ALLOYS

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Nomura, Hikaru	Saitama, JP	19	37
Yoshikawa, Shunsaku	Tokyo, JP	52	138

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
7.5 Year Payment	$3600.00	$1800.00	$900.00	May 7, 2025
11.5 Year Payment	$7400.00	$3700.00	$1850.00	May 7, 2029

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
November 07, 2017	US,9808890,B2   US9808890B2	GRANTED PATENT AS SECOND PUBLICATION
March 26, 2015	US,20150086263,A1   US20150086263A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 9808890

Solder alloy

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