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United States of America Patent

PATENT NO 9808864
SERIAL NO

14858036

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A lamination molding apparatus which can lower the oxygen concentration in a molding room in short time is provided. A lamination molding apparatus, including a molding room; a processing head; a driving device housing room housing a driving device moving the processing head; a partitioning section to partition the molding room from the driving device housing room; a discharging section to discharge gas in the molding room; and an inert gas supplying apparatus to supply the inert gas to both of the molding room and to the driving device housing room.

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Patent Owner(s)

Patent OwnerAddress
SODICK CO LTDKANAGAWA COUNTY YOKOHAMA JAPAN BUILDING AREA ZHONG TING TAIWAN THREE 12 1 YOKOHAMA-SHI KANAGAWA

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kawada, Shuichi Kanagawa, JP 18 222
Muranaka, Katsutaka Kanagawa, JP 16 131
Okazaki, Shuji Kanagawa, JP 34 300

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