Glass system for hermetically joining Cu components, and housing for electronic components
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 31, 2017
Grant Date -
Jun 5, 2014
app pub date -
Mar 5, 2012
filing date -
Mar 7, 2011
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An housing for electronic components, such as LEDs and/or FETs, is provided. The housing has a base body having an upper surface that at least partially defines a mounting area for an electronic functional element, such that the base body provides a heat sink for the electronic functional element. The base body has a lower surface and a lateral surface and includes a connecting body for the electronic functional element, which is joined to the base body a glass layer formed by an alkali titanium silicate glass.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully