Method of mounting electronic component to circuit board
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United States of America Patent
Stats
-
Oct 31, 2017
Issued Date -
N/A
app pub date -
Jul 29, 2013
filing date -
Jul 30, 2012
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An method of mounting electronic component includes: providing a connecting layer between a wiring and an electronic component, the connecting layer including a conductive layer formed of a solder powder-containing resin composition containing thermosetting resin, solder powder, and a reducing agent and one or two layers of a thermoplastic resin layer formed of thermoplastic resin; and electrically connecting the electronic component to the wiring through the connecting layer.
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Cited Art Landscape
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- H05K Class
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- 8 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Apr 30, 2025 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Apr 30, 2029 |
