Method for making a multilayer flexible printed circuit board
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United States of America Patent
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Oct 31, 2017
Grant Date -
N/A
app pub date -
Oct 5, 2016
filing date -
Jun 7, 2016
priority date (Note) -
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Abstract
A flexible printed circuit board with multiple layers includes an inner wiring substrate and at least one outer wiring plate. Each outer wiring plate is connected to one surface of the inner wiring substrate, and defines at least one through hole which passes through the outer wiring plate to expose the inner wiring substrate. Each outer wiring plate further includes an adhesive plate connected to the inner wiring substrate. The adhesive plate includes a stepped portion extending towards a center of the through hole.
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