Gas filled subsea electronics housing with spring engaged heat sink
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United States of America Patent
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Oct 31, 2017
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app pub date -
Dec 15, 2015
filing date -
Dec 15, 2015
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Abstract
Heat sinks that cool electronics are mounted within a subsea housing or vessel. Springs are used to provide pressure between the heat sinks and a vessel wall. Vessel wall deformation caused by external seawater pressure is absorbed by the springs, which maintain a pre-load force according to the spring characteristics. The mechanism also allows for rack mounting of the electronics without the need for manual access in the relatively compact vessel or housing.
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