Etch isolation LPCC/QFN strip

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United States of America Patent

PATENT NO 9806006
SERIAL NO

11916242

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Abstract

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Various structures and fabrication methods for leadless plastic chip carrier (QFN) packages which utilize carriers in strip format, wherein the leads (or terminals) are formed to be electrically isolated from one another within each unit and in which the units are formed to be electrically isolated from one another within the strip using chemical etching techniques.

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Patent Owner(s)

Patent OwnerAddress
UTAC HEADQUARTERS PTE LTD22 ANG MO KIO INDUSTRIAL PARK 2 SINGAPORE 569506

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kwan, Kin Pui Hong Kong, CN 18 1077
Li, Tung Lok Hong Kong, CN 12 244
Tsang, Kwok Cheung Hong Kong, CN 28 1547

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