Liquid sealing material and electronic component using same

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United States of America Patent

PATENT NO 9805998
APP PUB NO 20150175856A1
SERIAL NO

14416045

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Abstract

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The purpose of the present invention is to provide: a liquid sealing material which has excellent PCT (pressure cooker test) resistance; and an electronic component which is obtained by sealing a part to be sealed with use of the liquid sealing material. A liquid sealing material of the present invention contains (A) a liquid epoxy resin, (B) a curing agent, (C) a silica filler and (D) a coupling agent, and is characterized in that the boron content in the silica filler (C) has an average of 1-50 ppm.

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Patent Owner(s)

Patent OwnerAddress
NAMICS CORPORATIONNIIGATA-SHI NIIGATA 950-3131

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ishikawa, Seiichi Niigata, JP 21 181
Kohara, Kazuyuki Niigata, JP 10 130
Yoshii, Haruyuki Niigata, JP 8 41

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