Wafer scale packaging
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United States of America Patent
Stats
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Oct 31, 2017
Issued Date -
N/A
app pub date -
Jul 25, 2014
filing date -
Jul 25, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of wafer scale packaging acoustic resonator devices and an apparatus therefor. The method including providing a partially completed semiconductor substrate comprising a plurality of single crystal acoustic resonator devices, each having a first electrode member, a second electrode member, and an overlying passivation material. At least one of the devices to be configured with an external connection, a repassivation material overlying the passivation material, an under metal material overlying the repassivation material. Copper pillar interconnect structures are then configured overlying the electrode members, and solder bump structures are form overlying the copper pillar interconnect structures.
First Claim
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International Classification(s)
Cited Art Landscape
Patent Citation Ranking
- 2 Citation Count
- H01L Class
- 18.50 % this patent is cited more than
- 8 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Apr 30, 2025 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Apr 30, 2029 |
