Semiconductor package with multiple molding routing layers and a method of manufacturing the same

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United States of America Patent

PATENT NO 9805955
SERIAL NO

15347641

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Abstract

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Embodiments of the present invention are directed to a method of manufacturing a semiconductor package with an internal routing circuit. The internal routing circuit is formed from multiple molding routing layers in a plated and etched copper terminal semiconductor package by using an inkjet process to create conductive paths on each molding compound layer of the semiconductor package.

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Patent Owner(s)

Patent OwnerAddress
UTAC HEADQUARTERS PTE LTD22 ANG MO KIO INDUSTRIAL PARK 2 SINGAPORE 569506

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sirinorakul, Saravuth Bangkok, TH 79 565
Yenrudee, Suebphong Bangkok, TH 16 9

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