Plasma processing apparatus

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United States of America Patent

PATENT NO 9805916
APP PUB NO 20150122421A1
SERIAL NO

14531014

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Abstract

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In a plasma processing apparatus, target values for feedback control to be applied to a progressive wave power PF as control parameters, i.e., control instruction values Con and Coff are switched during a pulse-on period Ton and a pulse-off period Toff in each cycle of a modulation pulse, respectively. That is, a first feedback control for making the progressive wave power PF approximate to a first control instruction value Con is performed during the pulse-on period Ton, whereas a second feedback control for making the progressive wave power PF approximate to a second control instruction value Coff is performed during the pulse-off period Toff.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITEDTOKYO
DAIHEN CORPORATION1-11 TAGAWA 2-CHOME YODOGAWA-KU OSAKA-SHI OSAKA 532-8512

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kadooka, Shunsuke Osaka, JP 1 45
Konno, Hiroo Miyagi, JP 2 97

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