Methods for removing contamination from surfaces in substrate processing systems
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United States of America Patent
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Oct 31, 2017
Grant Date -
Oct 6, 2016
app pub date -
Apr 28, 2015
filing date -
Apr 3, 2015
priority date (Note) -
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Abstract
Methods for removing contamination from a surface disposed in a substrate processing system are provided herein. In some embodiments, a method for removing contaminants from a surface includes: providing a first process gas comprising a chlorine containing gas, a hydrogen containing gas, and an inert gas to a process chamber having the surface disposed within the process chamber; igniting the first process gas to form a plasma from the first process gas; and exposing the surface to the plasma to remove contaminants from the surface. In some embodiments, the surface is an exposed surface of a process chamber component. In some embodiments, the surface is a surface of a first layer disposed atop a substrate, such as a semiconductor wafer.
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