Radio-frequency loss reduction in photonic circuits
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United States of America Patent
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Oct 31, 2017
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Apr 15, 2016
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Apr 16, 2015
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Abstract
In photonic integrated circuits implemented in silicon-on-insulator substrates, non-conductive channels formed, in accordance with various embodiments, in the silicon device layer and/or the silicon handle of the substrate in regions underneath radio-frequency transmission lines of photonic devices can provide breaks in parasitic conductive layers of the substrate, thereby reducing radio-frequency substrate losses.
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