Cleaning agent for semiconductor substrates and method for processing semiconductor substrate surface
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 31, 2017
Issued Date -
N/A
app pub date -
Apr 26, 2013
filing date -
Apr 27, 2012
priority date (Note) -
In Force
status (Latency Note)
![]() |
A preliminary load of PAIR data current through [] has been loaded. Any more recent PAIR data will be loaded within twenty-four hours. |
PAIR data current through []
A preliminary load of cached data will be loaded soon.
Any more recent PAIR data will be loaded within twenty-four hours.
![]() |
Next PAIR Update Scheduled on [ ] |

Importance

US Family Size
|
Non-US Coverage
|
Patent Longevity
|
Forward Citations
|
Abstract
A cleaning agent is provided for a semiconductor substrate superior in corrosion resistance of a tungsten wiring or a tungsten alloy wiring, and superior in removal property of polishing fines (particle) such as silica or alumina, remaining at surface of the semiconductor substrate, in particular, at surface of a silicon oxide film such as a TEOS film, after a chemical mechanical polishing process; and a method for processing a semiconductor substrate surface. A cleaning agent for a semiconductor substrate is to be used in a post process of a chemical mechanical polishing process of the semiconductor substrate having a tungsten wiring or a tungsten alloy wiring, and a silicon oxide film, comprising (A) a phosphonic acid-based chelating agent, (B) a primary or secondary monoamine having at least one alkyl group or hydroxyalkyl group in a molecule and (C) water, wherein a pH is over 6 and below 7.
First Claim
all claims..Other Claims data not available
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
FUJIFILM CORPORATION | TOKYO 106-8620 |
International Classification(s)

- 2013 Application Filing Year
- H01L Class
- 22267 Applications Filed
- 20713 Patents Issued To-Date
- 93.03 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Kawada, Hiromi | Kawagoe, JP | 2 | 15 |
# of filed Patents : 2 Total Citations : 15 | |||
Maesawa, Tsuneaki | Kawagoe, JP | 20 | 423 |
# of filed Patents : 20 Total Citations : 423 | |||
Mizuta, Hironori | Kawagoe, JP | 17 | 133 |
# of filed Patents : 17 Total Citations : 133 |
Cited Art Landscape
- No Cited Art to Display

Patent Citation Ranking
- 1 Citation Count
- H01L Class
- 18.50 % this patent is cited more than
- 8 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Apr 30, 2025 |
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Apr 30, 2029 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

Legal Events
Date | Code | Event | Description |
---|---|---|---|
Apr 27, 2021 | MAFP | MAINTENANCE FEE PAYMENT | free format text: PAYMENT OF MAINTENANCE FEE, 4TH YR, SMALL ENTITY (ORIGINAL EVENT CODE: M2551); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY year of fee payment: 4 |
May 09, 2019 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:DMAR ENGINEERING, INC.;REEL/FRAME:049152/0471 Owner name: QINGDAO MARINE ENGINEERING UNDERWATER EQUIPMENT IN Effective Date: May 09, 2019 |
Nov 21, 2017 | I | Issuance | |
Nov 01, 2017 | STCF | INFORMATION ON STATUS: PATENT GRANT | free format text: PATENTED CASE |
Sep 22, 2016 | P | Published | |
Mar 16, 2015 | F | Filing |

Matter Detail

Renewals Detail
