Aqueous primer composition for enhanced film formation and method of using the same
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United States of America Patent
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Oct 31, 2017
Grant Date -
Feb 16, 2017
app pub date -
Nov 1, 2016
filing date -
Oct 4, 2013
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Abstract
A water-based bonding primer composition and a method of applying the same onto a metallic surface prior to adhesive bonding. The bonding primer composition is a water-based dispersion containing water, one or more epoxy resins, one or more curing agents, a silane compound, a low amount of propylene carbonate (PC), and optional additives. The bonding primer composition can form substantially smooth films by spraying, and at the same time, meet environmental regulations and provide high bonding performance.
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