Structural member for electronic devices
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United States of America Patent
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Oct 31, 2017
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N/A
app pub date -
Oct 28, 2015
filing date -
Nov 27, 2014
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Abstract
Provided is a structural member for electronic devices which uses a material that is flexible and has excellent restoration properties after extension and stress relaxation properties. The structural member for electronic devices has the following properties A and B: (Property A) In a case where predetermined deformation is applied, stress that applies the deformation is relaxed (reduced) with time: and (Property B) In a case where the stress that applies deformation is 0, the deformation rarely remains while a resin composition is recovered. That is, when stress is 0, residual strain substantially becomes 0 (specifically 3% or lower).
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