Rosin-free thermosetting flux formulations
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United States of America Patent
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Oct 31, 2017
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Dec 31, 2014
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Dec 31, 2013
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Abstract
Rosin-free thermosetting flux formulations for enhancing the mechanical reliability of solder joints. In accordance with one or more aspects, a solder paste as shown and described herein imparts improved or enhanced solder joint properties relating to at least one of drop shock, thermal cycling, thermal shock, shear strength, flexural strength performance, and/or other thermal-mechanical performance attributes.
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