Hybrid lead-free solder wire
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United States of America Patent
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Oct 31, 2017
Issued Date -
N/A
app pub date -
Mar 21, 2016
filing date -
Mar 21, 2016
priority date (Note) -
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Abstract
A lead-free solder wire includes a core wire with a first alloy and a shell coating layer with a second alloy. The first alloy may be composed of Bi—Ag, Bi—Cu, Bi—Ag—Cu, or Bi—Sb; and the second alloy may be composed of Sn, In Sn—Ag, Sn—Cu, Sn—Ag—Cu, Sn—Zn, Bi—Sn, Sn—In, Sn—Sb or Bi—In, such that the shell coating layer is applied to a surface of the core wire. In another implementation, the lead free solder wire may include a first wire with a first alloy and a second wire with a second alloy. The first alloy may be composed of Bi—Ag, Bi—Cu, Bi—Ag—Cu, or Bi—Sb; and the second alloy may be composed of Sn, Sn—Ag, Sn—Cu, Sn—Ag—Cu, Sn—Zn, Bi—Sn, Sn—In, Sn—Sb or Bi—In, such that the first alloy of the first wire and the second alloy of the second wire are braided together.
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
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INDIUM CORPORATION | 34 ROBINSON ROAD CLINTON NY 13323 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
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Lee, Ning-Cheng | New Hartford, US | 46 | 254 |
# of filed Patents : 46 Total Citations : 254 | |||
Zhang, Hongwen | New Hartford, US | 18 | 354 |
# of filed Patents : 18 Total Citations : 354 |
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