Multi-warm forming device and the forming method thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9802236
APP PUB NO 20170136516A1
SERIAL NO

15157501

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A multi-warm forming device and the forming method are disclosed. A multi-warm forming device according to one or a plurality of exemplary embodiments of the present invention may include: a lower mold die that is disposed on a bolster for a process and in which a mold mounting portion having at least one space portion is formed at a center thereof; a lower mold that is disposed at an upper surface of a mold mounting portion of the lower mold die, in which a plurality of gas supply passages formed therein in a vertical direction are connected to a gas supply device of an outside through a gas supply line, and a lower forming surface is formed at an upper surface thereof; an upper mold that is mounted on a slider of an upper portion to be able to be moved up and down corresponding to the lower mold at an upper portion of the lower mold die, in which an upper forming surface is formed at a lower surface corresponding to the lower mold, an upper mold face surface is formed at a circumference of the upper forming surface, and a plurality of heating cartridges are mounted inside along the upper forming surface and the upper mold face surface; and a blank holder of which the mold mounting portion is inserted into a penetration hole that is formed corresponding to the mold mounting portion, is able to be moved in a vertical direction by a guide post and a cushion spring that are mounted within the lower mold die, and in which a plurality of heating cartridges are mounted along a holder face surface that restrains a material together with the upper mold face surface at an early stage of a forming process.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
SUNGWOO HITECH CO LTD148-12 DALSAN-RI JEONGKWAN-MYEON KIJANG-KUN PUSAN-CITY

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kim, Rae Hyeong Busan, KR 3 2
Lee, Mun Yong Busan, KR 57 190

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Apr 30, 2025
11.5 Year Payment $7400.00 $3700.00 $1850.00 Apr 30, 2029
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00