Electronic device casing including coupling structure and method of manufacturing same
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United States of America Patent
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Oct 24, 2017
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app pub date -
Nov 29, 2012
filing date -
Nov 29, 2012
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Abstract
A method for manufacturing an electronic device casing having a coupling structure is provided. The electronic device casing is made of a casing material including a supportive substrate and a first thermoplastic substrate. A preliminary connecting section is formed on the first thermoplastic substrate by a hot-pressing molding process, and a molding plastic material is injected onto the preliminary connecting section by an in-mold injection process. After being cooled, the molding plastic material engages with the preliminary connecting section to form a secondary connecting section for a coupling element to couple with. Thus, the coupling structure of the electronic device casing can be directly formed during a manufacturing process without any additional procedures, thereby overall manufacturing time and costs are reduced.
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