Solder preforms and solder alloy assembly methods
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United States of America Patent
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Oct 24, 2017
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app pub date -
Mar 15, 2013
filing date -
Mar 20, 2012
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Abstract
A method of assembling components, such as electronic components, onto a substrate, such as an electronic substrate, includes applying solder paste to an electronic substrate to form a solder paste deposit, placing a low temperature preform in the solder paste deposit, processing the electronic substrate at a reflow temperature of the solder paste to create a low temperature solder joint, and processing the low temperature solder joint at a reflow temperature that is lower than the reflow temperature of the solder paste. Other methods of assembling components and solder joint compositions are further disclosed.
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