Printed circuit board having a ground plane with angled openings oriented between 30 to 60 degrees
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United States of America Patent
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Oct 24, 2017
Issued Date -
N/A
app pub date -
Dec 9, 2013
filing date -
Dec 11, 2012
priority date (Note) -
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Abstract
A printed circuit board that includes conductive layers separated by insulation layers of dielectric material, at least one conductive layer being patterned and having at least one signal line embedded in an insulation material, whereby a conductive ground plan layer, separated by the insulation material and lying in a predetermined distance (d) from the at least one signal line includes a ground plane area associated to and extending along the at least one signal line, the conductive layer associated to and extending along the at least one signal line is provided with openings therein. Preferably the openings are spaces between conducting stripes, extending, seen from above, across the at least one signal line, the conducting stripes being integrally connected with the conductive remainder of the conductive layer.
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