Elastic wave device

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United States of America Patent

PATENT NO 9799819
SERIAL NO

14737723

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Abstract

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An elastic wave device is configured such that a first surface acoustic wave chip including a piezoelectric substrate is mounted on a package board, a center of the first surface acoustic wave chip is shifted from a center of the package board when viewed from above, and a crystal Z-axis orientation of the piezoelectric substrate of the first surface acoustic wave chip is slanted to extend toward an outer side portion from a central portion of the package board as it progresses toward an upper surface from a lower surface of the piezoelectric substrate.

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Patent Owner(s)

Patent OwnerAddress
MURATA MANUFACTURING CO LTDKYOTO JAPAN KYOTO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nishi, Hiroyuki Nagaokakyo, JP 33 482
Shin, Yasuaki Nagaokakyo, JP 7 9
Watanabe, Kazushi Nagaokakyo, JP 145 8134

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