Image sensor and method for manufacturing same
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United States of America Patent
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Oct 24, 2017
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N/A
app pub date -
Jul 8, 2014
filing date -
Jul 8, 2013
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Abstract
Disclosed is an image sensor, which is characterized by increased strength of adhesion between a photoconductive layer and a substrate, and which includes a protective film formed on the surface of a substrate having a pad electrode, a buffer layer formed on the protective film and composed of a precious metal material or an oxide material, a photoconductive layer formed on the buffer layer, and an upper electrode formed on the photoconductive layer.
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