Method for forming a case for an electronic device and manufactured case structure for electronic device
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United States of America Patent
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Oct 24, 2017
Grant Date -
Dec 18, 2014
app pub date -
Apr 9, 2014
filing date -
Jun 17, 2013
priority date (Note) -
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Abstract
A method for forming a case for an electronic device and a manufactured case structure for an electronic device are provided. The method for forming a case for an electronic device comprises the following steps. Provide a plastic material. Provide a plurality of PCM microcapsules. Mix the plastic material and the plurality of PCM microcapsules so as to form a housing material. Form a case from the housing material by injection molding. The manufactured case structure for an electronic device comprises a plastic layer and a plurality of PCM microcapsules. The plurality of PCM microcapsules are dispersed in the plastic layer.
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