Method and apparatus for liquid treatment of wafer shaped articles
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United States of America Patent
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Oct 24, 2017
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app pub date -
Jun 16, 2014
filing date -
Jun 16, 2014
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Abstract
In an apparatus for treating a wafer-shaped article, a spin chuck is provided for holding and rotating a wafer-shaped article. A liquid dispenser comprises a check valve positioned so as to prevent process liquid from dripping out of a discharge nozzle of the liquid dispenser. A valve seat of the check valve is at a distance in a range of 20 mm to 100 mm from an outlet opening of said discharge nozzle.
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