Reconfigurable high speed memory chip module and electronic device with a reconfigurable high speed memory chip module

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United States of America Patent

PATENT NO 9798692
SERIAL NO

14800682

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Abstract

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A reconfigurable high speed memory chip module includes a type of memory cell array group, a first transmission bus, and a logic unit. The type memory cell array group includes multiple memory cell array integrated circuits (ICs). The first transmission bus coupled to the type memory cell array group has a first programmable transmitting or receiving data rate, a first programmable transmitting or receiving signal swing, a first programmable bus width, and a combination thereof. The logic unit is coupled to the first transmission bus for accessing the type memory cell array group through the first transmission bus.

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Patent Owner(s)

  • ETRON TECHNOLOGY, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ken, Weng-Dah Hsinchu, TW 15 116
Lu, Chao-Chun Taipei, TW 116 219
Sung, Jan-Mye Taoyuan, TW 3 34

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