Molding sand for three dimensional laminate molding
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United States of America Patent
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Oct 24, 2017
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Sep 10, 2012
filing date -
May 17, 2012
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Abstract
According to the invention, by setting the linear thermal expansion amount when a mold made of a molding sand is heated from a room temperature to 1000° C. to be not more than 0.9%, and the ratio (D/d) between the diameter of a slump (D) and the diameter of a slump cone (d) in a slump test of the molding sand having a hardening agent kneaded to be not less than 1.65, a molding sand preferable for use in a mold produced using the self-hardening type of three dimensional laminate molding sand mold, having low thermal expansibility preventing occurrence of a veining defect, and capable of forming a large and complicated shape can be obtained.
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