Direct bond transfer layers for manufacturable sealing of microfluidic chips
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United States of America Patent
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Oct 24, 2017
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app pub date -
Nov 20, 2015
filing date -
Nov 20, 2015
priority date (Note) -
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Abstract
Techniques for use of wafer bonding techniques for sealing of microfluidic chips are provided. In one aspect, a wafer bonding sealing method includes the steps of: forming a first oxide layer coating surfaces of a first wafer, the first wafer having at least one fluidic chip; forming a second oxide layer on a second wafer; and bonding the first wafer to the second wafer via an oxide-to-oxide bond between the first oxide layer and the second oxide layer to form a bonded wafer pair, wherein the second oxide layer seals the at least one fluidic chip on the first wafer. The second wafer can be at least partially removed after performing the bonding, and fluidic ports may be formed in the second oxide layer. A fluidic chip device is also provided.
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International Classification(s)
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- B29C:SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTAN....
- B81C:PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE M....
- B01L:CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENE....
- G01N:INVESTIGATING OR ANALYSING MATERIALS BY DETERMININ....
- B81B:MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-ME....
- B31B:MAKING BOXES, CARTONS, ENVELOPES, OR BAGS
- B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
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