Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards
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United States of America Patent
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Oct 17, 2017
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app pub date -
Apr 15, 2016
filing date -
Jul 6, 2010
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Abstract
Embodiments of the present invention relates generally to the manufacture of printed circuit boards (PCB's) or printed wiring boards (PWB's), and particularly to methods for treating smooth copper surfaces to increase the adhesion between a copper surface and an organic substrate. More particularly, embodiments of the present invention related to methods of achieving improved bonding strength of PCBs without roughening the topography of the copper surface. The bonding interface between the treated copper and the resin layer of the PCB exhibits excellent resistance to heat, moisture, and chemicals involved in post-lamination process steps.
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