Air venting on proximity sensor
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United States of America Patent
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Oct 17, 2017
Grant Date -
N/A
app pub date -
Jul 25, 2016
filing date -
Jul 25, 2016
priority date (Note) -
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Abstract
One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to an optical sensor that includes a substrate and a sensor die. A through-hole extends through the substrate, and a trench is formed in a first surface of the substrate and is in fluid communication with the through-hole. The sensor die is attached to the first surface of the substrate and covers the first through-hole and a first portion of the trench. A second portion of the trench is left uncovered by the sensor die.
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