Semiconductor package and manufacturing method thereof
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United States of America Patent
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Oct 17, 2017
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N/A
app pub date -
Nov 30, 2015
filing date -
Dec 30, 2014
priority date (Note) -
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Abstract
Disclosed herein is a semiconductor package in which a semiconductor chip and a mounting device are packaged together. The semiconductor package includes a semiconductor chip, a mounting block on which a first mounting device is mounted on a substrate that includes a circuit formed thereon, and an interconnection part configured to electrically connect the semiconductor chip to the mounting block.
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