Reducing or eliminating pre-amorphization in transistor manufacture
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United States of America Patent
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Oct 17, 2017
Issued Date -
Feb 9, 2017
app pub date -
Oct 20, 2016
filing date -
May 16, 2011
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Abstract
A method for fabricating field effect transistors using carbon doped silicon layers to substantially reduce the diffusion of a doped screen layer formed below a substantially undoped channel layer includes forming an in-situ epitaxial carbon doped silicon substrate that is doped to form the screen layer in the carbon doped silicon substrate and forming the substantially undoped silicon layer above the carbon doped silicon substrate. The method may include implanting carbon below the screen layer and forming a thin layer of in-situ epitaxial carbon doped silicon above the screen layer. The screen layer may be formed either in a silicon substrate layer or the carbon doped silicon substrate.
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