Electronic component termination and assembly by means of transient liquid phase sintering metallurgical bond

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United States of America Patent

PATENT NO 9793057
SERIAL NO

15149309

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Abstract

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An improved method for forming a capacitor is provided as is a capacitor, or electrical component, formed by the method. The method includes providing an aluminum containing anode with an aluminum oxide dielectric thereon; forming a cathode on a first portion of the aluminum oxide dielectric; bonding an anode lead to the aluminum anode on a second portion of the aluminum oxide by a transient liquid phase sintered conductive material thereby metallurgical bonding the aluminum anode to the anode lead; and bonding a cathode lead to said cathode.

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Patent Owner(s)

Patent OwnerAddress
KEMET ELECTRONICS CORPORATIONONE EAST BROWARD BLVD 5TH FLOOR FORT LAUDERDALE FL 33301

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bultitude, John Simpsonville, US 71 670
McConnell, John E Simpsonville, US 45 1003
Renner, Garry L Simpsonville, US 13 196

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