Circuit substrate structure and method for manufacturing thereof
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United States of America Patent
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Oct 17, 2017
Issued Date -
Jul 10, 2014
app pub date -
Dec 31, 2013
filing date -
Jan 10, 2013
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Abstract
The invention provides a circuit substrate structure and a method for manufacturing thereof. The circuit substrate structure includes a substrate, a pixel array layer, a display unit, a peripheral circuit layer, at least one integrated circuit chip, a flexible printed circuit board, at least one flattening material layer and a passivation layer. In the circuit substrate structure, the flattening material layer is positioned on the peripheral circuit layer, and possesses at least one opening corresponded to and around the integrated circuit chip. By positioning the flattening material layer, the circuit substrate structure possesses a flat surface, and prevents producing air bubbles, so as to enhance the reliability of the display device.
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