Method for fabricating an embedded pattern using a transfer-based imprinting
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United States of America Patent
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Oct 17, 2017
Issued Date -
Oct 23, 2014
app pub date -
Feb 28, 2014
filing date -
Apr 22, 2013
priority date (Note) -
Published
status (Latency Note)
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Abstract
In a method for fabricating an embedded pattern using a transfer-based imprinting, an adhesive layer is formed on a substrate. The adhesive layer has a photo curable resin. A stamp having a protruded pattern is prepared. A thin-film layer is formed on an outer surface of the protruded pattern of the stamp. The stamp having the thin-film layer contact with the adhesive layer is pressed to selectively transfer the thin-film layer of the protruded pattern to the adhesive layer. Ultraviolet rays (UV) are irradiated to cure the adhesive layer. The stamp is removed.
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International Classification(s)
- B82Y:SPECIFIC USES OR APPLICATIONS OF NANO-STRUCTURES; ....
- B29C:SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTAN....
- G09F:DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLA....
- G02B:OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
- B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
- B44C:PRODUCING DECORATIVE EFFECTS
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