Device and method for a detonator with improved flyer layer adhesion
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United States of America Patent
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Oct 17, 2017
Issued Date -
N/A
app pub date -
Apr 14, 2016
filing date -
Apr 14, 2015
priority date (Note) -
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Abstract
A chip slapper is presented, having a substrate, a conductive layer disposed above the substrate face, and an intermediate layer disposed between the substrate face and the conductive layer. The conductive layer and intermediate layer form a first land and a second land atop the substrate face, with a bridge formed of the intermediate layer spanning between the first land and the second land. A first adhesion portion is attached to the first land, and a second adhesion portion is attached to the second land, wherein at least a portion of the bridge is not overlaid by the first adhesion portion or the second adhesion portion.
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