Electro plating device
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United States of America Patent
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Oct 17, 2017
Issued Date -
May 21, 2015
app pub date -
Jun 24, 2013
filing date -
Jul 2, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
An electro plating device includes a pipe inside seal mechanism which occludes an inner channel of a steel pipe, a tubular insoluble electrode which is disposed in a pipe end so as to be opposite to a female screw, a plating solution feed mechanism which includes a plurality of nozzles which extend radially with a pipe axis of the steel pipe as a center, and a pipe end seal mechanism which accommodates the nozzles thereinside and is mounted to the pipe end, when viewed in the pipe axial direction, a tip of each of the nozzles is positioned between the female screw and the insoluble electrode, and each of the nozzles injects the plating solution toward a direction which intersects an extension direction of the nozzle, the direction being a rotational direction of a clockwise direction or a counterclockwise direction in which the pipe axis is the center.
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