Manufacturing method of multilayer printed wiring board
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 10, 2017
Grant Date -
Oct 6, 2016
app pub date -
Mar 26, 2014
filing date -
Sep 20, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A wiring substrate is manufactured by attaching an adhesive protective film to a metal-foiled laminate sheet, forming bottomed via holes by partially removing the film and an insulating film, filling conductive pastes into the holes, and peeling the film. A wiring substrate is manufactured by forming an adhesive protective layer so as to cover a patterned metal foil on a metal-foiled laminate sheet, forming bottomed step via holes by partially removing the layer and an insulating film, filling conductive pastes into the holes, and peeling off a protective film. The wiring substrate and the second wiring substrate are laminated in such a way that protruding parts of the pastes come into contact with respective protruding parts of the pastes.
First Claim
Other Claims data not available
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
- 3 Citation Count
- H05K Class
- 18.22 % this patent is cited more than
- 8 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Apr 10, 2025 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Apr 10, 2029 |
