Housing, electronic device using same, and method for making same
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United States of America Patent
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Oct 10, 2017
Grant Date -
Jun 16, 2016
app pub date -
Apr 13, 2015
filing date -
Dec 11, 2014
priority date (Note) -
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Abstract
A housing includes a metal substrate, an adhesive layer formed on the metal substrate, and a resin film formed on the adhesive layer, the metal substrate, the adhesive layer and the resin film cooperatively form a cavity through a stamping process, an internal structure needed by the housing is formed in the cavity through an injection process, and the internal structure is formed on the resin film.
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